International Journal on Engineering Applications, Volume 11, Issue 6, Pages 384-393 , 01/01/2023
Multiphysics Modeling for Microwavable Packaging of Ready-to-Eat Baked Spinach with Cheese
Abstract
A 3D COMSOL Multiphysics model has been constructed for a stationary microwave oven and used to investigate the microwave heating process of ready-to-heat baked spinach with cheese. The model has simulated the 30 s of microwave heating for 3D geometries of food packages of varying sizes. Then Polylactic acid cup-shaped packages have been produced by using a 3D printer and tested in an experiment. In order to heat 100 g of baked spinach with cheese for 60 s, the cup-shaped packages with and without a shielded aluminum foil have been placed at the center of 1300 W microwave oven. The experimental temperature profiles obtained with a thermal imaging camera have demonstrated a good correlation with the simulated results. A uniform heating has been obtained in a cup-shaped package with a diameter of 6.7 cm and a height of 5.2 cm, shielded with the aluminum foil. A temperature at the center has been above 70 °C. The temperature differences at various locations have been less than 15 °C, indicating uniform temperature distribution. It has been also found out that the cup-shaped package has provided a better temperature distribution of the baked spinach with cheese than the commercial tray packaging. These findings may be implemented in the ready-to-heat food product development, by modifying the microwave cooking conditions in order to achieve a better heating uniformity, and the shape of microwavable packaging to maximize the cooking performance with the least amount of experimental expense and time.
Document Type
Article
Source Type
Journal
Keywords
Baked Spinach with CheeseCOMSOL MultiphysicsMicrowavable PackagingMicrowave HeatingMicrowave Oven with Stirrers
ASJC Subject Area
Mathematics : Applied MathematicsEngineering : ArchitectureMaterials Science : Materials Science (miscellaneous)Mathematics : Discrete Mathematics and CombinatoricsMathematics : LogicEngineering : Engineering (all)Computer Science : Computer Science Applications
Funding Agency
Thailand Research Fund