Bulletin of Electrical Engineering and Informatics, Volume 13, Issue 4, Pages 2774-2783 , 01/08/2024

Towards visual sentiment summary to understand customers’ satisfaction

Dao Thi Thanh Loan, Tran Anh Tuan

Abstract

Due to the COVID-19 pandemic, the shopping behavior of customers has been significantly affected and is being shifted towards online shopping. Understanding the customers’ opinions, attitudes, and emotions in feedback and comments plays an essential role in making decisions for organizations and individuals (e.g., companies and customers). In this study, we propose sentiment summaries from the customer knowledgebase (SSoCK) framework that analyses customer feedback and improve a mechanism for sentiment summarization by using text analysis including sentiment analysis. In the experiments, various domains from customer reviews (e.g., computer and Canon) are used to con-duct. The results show that the proposed SSoCK framework has the high performance of sentiment classification in terms of its accuracy when compared to the other approaches. Moreover, the proposed framework generates various kinds of sentiment summaries that can support managers/potential customers understand trending/interesting aspects of the product with customer satisfaction and can be easily updated with new reviews within the same domain without storing any original data.

Document Type

Article

Source Type

Journal

Keywords

AspectCustomer knowledgebaseCustomer satisfactionSentiment summarizationVisual summary

ASJC Subject Area

Computer Science : Computer Networks and CommunicationsComputer Science : Hardware and ArchitectureComputer Science : Information SystemsEngineering : Control and Systems EngineeringEngineering : Electrical and Electronic EngineeringMathematics : Control and OptimizationPhysics and Astronomy : InstrumentationComputer Science : Computer Science (miscellaneous)


Bibliography


Loan, D., & Tuan, T. (2024). Towards visual sentiment summary to understand customers’ satisfaction. Bulletin of Electrical Engineering and Informatics, 13(4) 2774-2783. doi:10.11591/eei.v13i4.7668

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